Agenda

Technologies of the future for adhesive bonds

Date

16 September 2019 - 18 September 2019

Venue

Miramar Palace, San Sebastian

Time

-

Price

Free

20th INTERNATIONAL CONFERENCE ON ADHESION AND ADHESIVES

TECNALIA is organising the 20th annual edition of the International Conference on Adhesion and Adhesives, in collaboration with the Spanish Group on Adhesion and Adhesives (GEAA), focussing on the problems of multimaterial structures. It will be a forum to exchange knowledge and technology on adhesive bonds over two days.

Aimed at

  • Specialised professionals
  • Manufacturers
  • Adhesive users that are searching for the latest technological developments and innovations on the market.
  • Industrial fabric that already uses adhesive solutions in their manufacturing processes, and is looking to improve their results.

Main topics

  • Adhesive synthesis and formulation
  • Adhesive and surface characterisation techniques
  • Adhesive applications of industrial interest
  • Adhesion engineering
  • Surface treatments
  • Bond durability

The “Multimaterial Structures” workshop will be held a day before the congress: it will address issues related to the role that adhesives play in developing solutions that combine various types of materials.

Proposal submission

The submission of proposals with real and practical examples has been encouraged for this edition. Pooling this knowledge will be of great interest to all industrial sectors that use adhesive bonding technology as a key factor in creating innovative sustainable products.

Key dates

  • 20 April - submission of abstracts
  • 10 May - accepted abstracts announced
  • 10 July - submission of final texts

Email for proposals: adhesivos@tecnalia.com