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8th International Congress on Architectural Envelopes

19 June 2018

TECNALIA brought together over 70 experts in San Sebastian to analyse the arrival of Industry 4.0 to façades

Digitalisation has burst into the world of façades to create more efficient designs in energy and production terms. This tendency has given rise to façades 4.0, which will be the main feature of the 8th International Congress on Architectural Envelopes, ICAE 2018, organised by the TECNALIA research and technological development centre, will take place from tomorrow, Wednesday, until Friday at the Kursaal Congress Palace in San Sebastian. Over 70 international experts will be present to address the possibilities that the use of Industry 4.0 offers to the world of architectural envelopes.

Over three days, this international conference will cover the use of innovative materials on facades, new façade installation methods with robots or the use of innovative technological solutions in the field of renovation. It will also look at the use of renewable energy in architectural envelopes, fire safety of façades, smart windows, new types of sensors for connected envelopes and new manufacturing methods, such as 3D printing.

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