News

Technologies of the future for adhesive bonds

26 August 2019

Adhesive transformation reaches very different sectors, mainly construction and aeronautics, seeking primarily to lighten joints in order to achieve weight reductions both in structural adhesive joints and in those in aerospace structures

TECNALIA, immersed in these developments, is calling on around a hundred companies on 17 and 18 September 2019 to host the 20th annual International Congress on Adhesion and Adhesives. For two days, this event will focus on multi-material structures where the main forum for the exchange of knowledge and technology will be held between specialised professionals, manufacturers and users of adhesives to present technological breakthroughs and the latest market developments and their applications in adhesive bonding technology.

The Congress covers all fields related to adhesion and adhesives: synthesis and formulation of adhesives, adhesive and surface characterisation techniques, applications of adhesives of industrial interest, adhesion engineering, surface treatments and joint durability. We will discover new applications of adhesives, such as self-bonding, BIO adhesives, etc. At TECNALIA we innovate in the replacement of conventional plasticisers with BIOplasticisers, the monitoring of the structural condition of adhesive joints, or the formulation of fast curing, among other fields.

To find out about all these innovations you can register at the following website: http://congreso-adhesivos.es/es/